Teaching Summary for Peter Sandborn



  • ENES 102 Statics (Fall 1998, Spring 2009)
  • HONR 219C Selling Technology: The Success and Failure of Technological Things (Spring 2008)
  • ENES 221 Dynamics (Fall 2000, Fall 2002, Spring 2004, Fall 2004, Spring 2007, Fall 2008)
  • ENME 462 Vibrations, Controls and Optimization II (Spring 1999, Spring 2000, Spring 2001, Fall 2003, Fall 2004, Spring 2006)
  • ENME 474 Electronic Systems Design,(Spring 2002, Spring 2003, Spring 2005)
  • ENME 770 Product and System Cost Analysis (Fall 1999, Fall 2001, Fall 2003, Fall 2005, Fall 2007)
  • Tutorials, workshops and short courses on various aspects of electronic system design and packaging (click here for list).
    • Electronic part obsolescence forecasting and management
    • Technology tradeoff analysis for electronic packaging
    • Cost analysis for electronic products and systems
    • Electronic product part selection and management
    • Electronic product supply chain management including contract assembly

Education Related Publications

P. Sandborn, J. Myers, T. Barron, and M. McCarthy, "Using Teardown Analysis as a Vehicle to Teach Electronic Systems Manufacturing Cost Modeling," International Journal of Engineering Education, Vol. 25, No. 1, pp. 42-52, 2009.

P. A. M. Sandborn and P. A. Sandborn, Using Embedded Resistor Emulation to Teach Measurement Methods and Associated Engineering Model Development, International Journal of Engineering Education, Vol. 23, No. 4, pp. 834-840, 2007.

P. Sandborn and C. F. Murphy, "Progress on Internet-Based Educational Material Development for Electronic Products and Systems Cost Analysis," in Proc. of the Electronic Components and Technology Conference, May 2001, pp. 1261-1266.

P. Sandborn, D. T. Allen, and C. F. Murphy, "New Course Development in Products and Systems Cost Analysis," Proc. of the Electronic Components and Technology Conference, pp. 1021-1026, May 2000.

Y. Joshi and P. Sandborn, "Electronic Products and Systems Research and Education for the 21st Century," Future Circuits International, Vol. 6, pp. 88-91, 2000.

Peter Sandborn
University of Maryland
Last Updated:
May 25, 2009
Emails: sandborn@umd.edu
Home Page: http://www.glue.umd.edu/~sandborn