Peter Sandborn is a Professor in the CALCE Electronic Products and Systems Center at the University of Maryland.  Dr. Sandborn’s group develops obsolescence forecasting algorithms, performs strategic design refresh planning, and lifetime buy quantity optimization.  Dr. Sandborn is the developer of the MOCA refresh planning tool.  MOCA has been used by private and government organizations worldwide to perform optimized refresh planning for systems subject to technology obsolescence.  Dr. Sandborn also performs research in several other life cycle cost modeling areas including maintenance planning and return on investment analysis for the application of prognostics and health management (PHM) to systems, total cost of ownership of electronic parts, transition from tin-lead to lead-free electronics, and general technology tradeoff analysis for electronic systems.

Dr. Sandborn has also developed and implemented part selection and management benchmarking and part obsolescence management benchmarking for Nortel, Schlumberger, Microsoft, Motorola, Honeywell, Lucas Aerospace and others.  Dr. Sandborn has taught industry short courses on electronic systems cost modeling and obsolescence management to Ericsson, Harris, IBM, StorageTek, Motorola, United Defense, FAA, UK Ministry of Defense, the U.S. Navy and other organizations.  Dr. Sandborn is a member of the U.S. Navy TRENT Shareholder Council and is the author of the U.S. DoD’s DMSMS working group’s DMSMS tool/data taxonomy.  Dr. Sandborn has been the principle investigator on programs for the U.S. Air Force, Army and Navy; the Defense Logistics Agency, Lockheed Martin, Northrop Grumman, Motorola, Argon ST, Ericsson, the Naval Surface Warfare Centers, and others.

Dr. Sandborn is an Associate Editor of the IEEE Transactions on Electronics Packaging Manufacturing and a member of the editorial board of the International Journal of Performability Engineering.  He is a past conference chair and program chair of the ASME Design for Manufacturing and Life Cycle Conference.  He is the author of over 150 technical publications and several books on electronic packaging and electronic systems cost analysis and was the winner of the 2004 SOLE Proceedings and 2006 Eugene L. Grant awards.  He has a B.S. degree in engineering physics from the University of Colorado, Boulder, in 1982, and the M.S. degree in electrical science and Ph.D. degree in electrical engineering, both from the University of Michigan, Ann Arbor, in 1983 and 1987, respectively.

Summary of Experience

• Electronic part obsolescence forecasting and management - DMSMS (Diminishing Manufacturing Sources and Material Shortages)
• Electronic part supply chain management
• Life cycle and manufacturing cost analysis of electronic systems
• Sustainment of electronic systems (reliability and obsolescence analysis)
• Prognostics and Health Management (application to electronic systems, maintenance planning, and return on investment analysis)
• Methodology and implementation of technology tradeoff analysis for electronic systems
• Warranty cost analysis
• Design-to-cost
• Design-for-manufacturability
• Design-for-environment
• MEMS packaging and reliability
• C, C++, and web-based client/server (Java) design tool development.

Detailed Experience

University of Maryland, College Park, Maryland
Professor, Mechanical Engineering  07/98 to present

• Director of the Electronic Systems Cost Modeling Laboratory. 
• Member of the Computer Aided Life Cycle Engineering (CALCE) Electronic Products and Systems Center.

Nu Thena Systems, Inc., Austin, Texas - Nu Thena provides software solutions for verifying the functional correctness of designs, optimizing an architectural design - including the partitioning of functionality into electronic hardware and embedded software, and establishing a test and verification framework for downstream (hardware and software) component design.
Chief Technical Officer - SavanSys  01/98 to 06/98

• Architected and implemented, web-based software tool for computing costs in a hardware/software design environment.

Savantage, Inc., Austin, Texas - Savantage provides virtual prototyping software and services to the electronic packaging and interconnect community.  Savantage, Inc. was acquired by Nu Thena Systems, Inc. in January 1998.
Chief Technical Officer   08/95 to 12/97
Vice President, Engineering   03/95 to 08/95
Founder 08/94

• Architected, implemented, and supported Savantage technology tradeoff analysis engines. This software implementation resulted in the SavanSys^TM software tool that is currently installed at Savantage customer sites worldwide.
• Developed and delivered to customers, design-to-cost and design-for-manufacturability methodology applied to electronic system assembly (SMT and MCM), die preparation (including bare die test and burn-in), and printed wiring board fabrication (conventional and microvia structures).
• Developed and delivered to customers, Savantage’s design-for-environment methodology including integrating energy/mass balance lifecycle analysis (LCA) within an activity-based manufacturing cost analysis system.
• Managed prototype and commercial development of Savantage’s web-based client/server tool, Prophet, resulting in successful delivery to customers. Performed the majority of the Java software development for the client portion of the product.
• Bid, managed, and successfully completed Savantage government contracts (DARPA MADE, DARPA Design-for-Environment - 1995-1997).
• Performed various customer support and application engineering activities, including modeling of customer fabrication and assembly lines, completing customer consulting contracts, preparing documentation, and software training.
• Participated in venture capital fund raising activities that resulted in over $3 million of financing for Savantage.

Microelectronics and Computer Technology Corporation (MCC), Austin, Texas
Senior Member of Technical Staff   02/90 to 03/95
Member of Technical Staff   03/87 to 02/90

Packaging and Interconnect Program (11/88 - 03/95)

• Developed and managed the Multichip Systems Design Advisor (MSDA) software development projects and associated government contracts (DARPA MADE, RASSP, and 93-25) - project members included Eastman Kodak, DEC, Hughes Aircraft, Bell Northern Research., Cadence, Mentor Graphics, and Intergraph.
• Performed Multichip Module (MCM) electrical design and analysis.
• Provided multidisciplinary tradeoff analysis to MCC technology development projects.
• Performed switching noise experimentation and modeling.

Computer Aided Design Program (03/87 - 11/88)

• Designed and implemented a large-signal time-domain transient simulation platform for the development of high-speed silicon and GaAs devices.

Education

• Ph.D. Electrical Engineering - May, 1987
  University of Michigan, Ann Arbor, Michigan
  Dissertation Title: Two-Dimensional Modeling of Gallium Arsenide Submicron Field-Effect Transistor Structures
  Advisor: Professor G. I. Haddad
• M.S. Electrical Science - December, 1983
  University of Michigan, Ann Arbor, Michigan
• B.S. Engineering Physics - May, 1982
  University of Colorado, Boulder, Colorado

Publications

• Author or co-author of over 150 technical papers, articles and book chapters (click here for list).
• Developer and presenter of tutorials, workshops, and short courses (click here for list).

Consulting

• Raydon, Corp. (2008), Electronic part obsolescence forecasting and management

• Ortho-Clinical Diagnostics (2008), Electronic part obsolescence forecasting and management

• Wärtsilä, Corp. (2008), Electronic part obsolescence forecasting and management

• Harris, Corp. (2006-2007), Electronic part obsolescence forecasting and management

• Cummins, Inc. (2006), Electronic part obsolescence forecasting and management

• Assett (2005), Electronic part obsolescence management

• UK Ministry of Defence (2004), Electronic part obsolescence forecasting and management

• Georgia Institute of Technology (2004), Top-down cost modeling for SOP applications

• United Defense (2004), Electronic part obsolescence forecasting and management

• Invensys (2003), Electronic part obsolescence forecasting and management

• Kollmorgen (2003), Electronic part obsolescence forecasting and management

• Potomac Photonics, Inc. (2002), Cost of ownership modeling for microvia printed circuit boards

• Honeywell International (2001), Contract assembly benchmarking

• IBM (2000), Electronic systems cost modeling.

• Emerson Electric Co. (2000), Supply chain management, contract assembly.

• Ericsson Radio Systems, Inc. (2000), Electronic systems cost modeling.

• Bosonics, Inc. (2000), Cost of ownership models.

• Lockheed-Martin Corporation (1999), Obsolescence analysis.

• Lucent Technologies, Inc. (1999), Provided software training and consulting on the Nu Thena SavanSys tool for technology tradeoff analysis of electronic packaging.

• Trimble Navigation, Limited (1998), Microvia printed circuit boards and chip scale packages.