[Books] | [Book Chapters] | [Papers] | [Tutorials]
E.B. Magrab, S.K. Gupta, F.P. McCluskey, and P.A. Sandborn, Integrated Product and Process Design and Development: The Product Realization Process, 2nd edition, CRC Press, 2009.
P. Sandborn, Course Notes on Manufacturing and Life Cycle Cost Analysis of Electronic Systems, CALCE EPSC Press, 2005.
M. Pecht, R. Solomon, P. Sandborn, C. Wilkinson, and D. Das, Life Cycle Forecasting, Mitigation Assessment and Obsolescence Strategies, CALCE EPSC Press, 2002.
P. A. Sandborn and H. Moreno, Conceptual Design of Multichip Modules and Systems, Kluwer Academic Publishers, 1994.
P. Sandborn and K. Feldman, “The Economics of PHM,” in Prognostics and Health Management of Electronics, ed. M. Pecht, John Wiley & Sons, Inc., Hoboken, NJ, pp. 85-118, 2008.
P. Sandborn and J. Myers, “Designing Engineering Systems for Sustainment,” Handbook of Performability Engineering, ed. K.B. Misra, Springer, pp. 81-103, London, 2008.
D. P. Fitzgerald, J. W. Herrmann, P. A. Sandborn, L. C. Schmidt, and T. H. Gogoll, “Constructing a Product Design for Environment Process,” in Handbook of Performability Engineering, ed. K.B. Misra, Springer, pp. 57-69, 2008.
D. P. Fitzgerald, J. W. Herrmann, P. A. Sandborn, L. C. Schmidt, and T. H. Gogoll, "Design for Environment (DfE): Strategies, Practices, Guidelines, Methods, and Tools," in Environmentally Conscious Mechanical Design, M. Kutz editor, John Wiley & Sons, Inc., pp. 1-24, 2007.
Seven chapters in Parts Selection and Management, M. Pecht editor, John Wiley & Sons, Inc., New York, NY, 2004:
P. Sandborn, "The Economics of Embedded Passives," in Integrated Passive Component Technology, R. Ulrich and L. Schaper editors, Wiley-IEEE Press, 2003.
P. A. Sandborn and M. Abadir, "Multichip Module Design," Multichip Modules, Design, Fabrication, and Testing, J. J. Licari editor, McGraw-Hill, Inc, pp. 21-78, 1995.
P. A. Sandborn and D. J. Herrell, "Electronic Module Technology," Physical Architecture and Packaging of Microelectronic Systems, R. Hannemann, A. Kraus and M. Pecht editors, John Wiley & Sons, Inc, New York, NY, pp. 189-249, 1994.
V. Prabhakar and
P. Sandborn, “A Part Total Ownership Cost Model for Long-Life Cycle Electronic
Systems,” to be published in International
J. of Computer Integrated Manufacturing.
Chaloupka, P. Sandborn, and A. Konoza, “The
Thermal Cycling Ramifications of Lead-Free Solder on the
Electronic Assembly Repair Process,” to be published IEEE Transactions on
on Components, Packaging and Manufacturing Technology.
P. Sandborn, V. Prabhakar and O. Ahmad, “Forecasting Technology Procurement Lifetimes for Use in Managing DMSMS Obsolescence,” Microelectronics Reliability