William M. Stowell, CFO
Dense-Pac Microsystems, Inc.
(714) 898-0007
Web site:
Kent Broussard (investors) Denise Harrison (media)Allen & Caron Inc. (714) 957-8440
Dense-Pac Microsytems Takes Founding Role in CALCE-EPSC3D Electronics Packaging Consortium
GARDEN GROVE, CA (December 22, 1998) . . . . Dense-Pac Microsystems, Inc. (Nasdaq:DPAC), a volume manufacturer of proprietary three-dimensional (3-D) high-density memory and system packaging, announced today that the University of Maryland-CALCE (The Computer Aided Life Cycle Engineering) in conjunction with Dense-Pac, has formed a consortium (CALCE-EPSC3D) to further the advancement of 3-D electronics. This consortium builds on the experience and the structure of the Electronic Product and System Consortium (CALCE-EPSC), which includes more than 40 member companies. The consortium includes companies and organizations that are suppliers and users of 3-D electronics packaging, as well as developers of design tools used to support 3-D electronics packaging techniques.

In addition to Dense-Pac, CALCE-EPSC includes such members as: Compaq Computer Corporation, Sun Microsystems, Tandem Computers, Sandia National Laboratories, the NASA Jet Propulsion Laboratory, AlliedSignal, Rockwell Collins, Raytheon Systems, Raytheon Sensors and Electronic Systems, Honeywell, Lockheed-Martin, Northrup Grumman, Boeing, Crane-Eldec, Crane-Hycroaire, Smith Industries, United Technologies, Vista Controls, General Motors, Visteon, Anadrill Schlumberger, Innova Electronics, AMP, Teradyne, Lambda Technologies, Qualmark and MTI.

CALCE-EPSC3D was formed to develop a scientific basis for innovative 3-D electronics packaging, and establish an educational and technology transfer infrastructure for the rapid dissemination and utilization of any new developments created as a result of its efforts. The alliance will create technology road maps for unique memory systems and sponsor technical sessions at major electronics conferences. The alliance will establish a web site devoted to the enhancement of 3-D electronics packaging and to educate users and designers of their functionality. A consortium meeting is planned for January 21, 1999, at CALCE. Companies are still being considered for membership in the consortium.

According to Dense-Pac's Chief Executive Officer, Richard Dadamo, 'In forming this consortium of major corporations, we have, in conjunction with the University of Maryland, taken a forefront position in 3-D electronics packaging manufacturing. We are committed to expanding the uses of and the potential markets for our technology and manufacturing processes. Our participation as the joint leader in the consortium will enable us to better assess the future trends in memory technology and to meet the needs of the market.'

Dense-Pac Microsystems, Inc. is a technology company that specializes in the design of proprietary and patented 3-D high-density packaging. The products allow the company's commercial, industrial and aerospace customers to pack huge amounts of memory into small spaces. Its commercial products include applications such as network servers, computer storage devices and medical instrumentation. Aerospace and industrial applications can include airborne and space avionics and such diverse areas as space satellites and missiles and high performance servers. Visit the Company's web site at

The above statements are forward looking statements and projections (including statements concerning plan and objectives of management for future operations and statements concerning earnings expectations) are based on management's belief as well as assumptions made by, and information available to, management. Although management believes that its expectations are based on reasonable assumptions, there can be no assurances that the Company's financial goals will be realized. Numerous factors may effect the Company's actual results and may cause results to differ materially from those expressed in forward-looking statements made by or on behalf of the Company. Some of those factors include, without limitation, demand and acceptance of new and existing products, technological and product obsolescence, availability of semiconductor devices at reasonable process, competitive factors and the availability of capital to finance growth. These and other risks are discussed in greater detail in the company's filings with the Securities and Exchange Commission.


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