Meeting Announcement for January 21, 1999
3D Electronic Packaging Alliance
Meeting Time: 8:00 AM to 4:00 PM, January 21, 1999 | Meeting Agenda: Complete agenda available here |
Meeting Location (Note - room change): Room 2460,
A.V. Williams Building (Building 115), University of Maryland, College Park,
MD Directions & Hotels - the A.V. Williams building is located below and to the right of the "Engineering" building (Building 089) colored yellow on the map. |
Press Releases: 12/22/98 - Dense-Pac press release on 3D Packaging Alliance 1/14/99 - EETimes Article on 3D Packaging Alliance |
Three-dimensional packaging promises to provide increased electrical performance and packaging density over conventional two-dimensional approaches. Over the last 10 years, many organizations have developed novel 3D packaging technologies and methodologies that provide size and performance increases for a wide range of quality, reliability, manufacturability and cost impacts. The objective of this alliance is to facilitate the design, manufacture, and use of cost effective high density, high performance, and high reliability 3D packaging.
Alliance Membership:
Alliance Goals:
Organizational Meeting:
An organizational meeting sponsored by CALCE and Dense-Pac Microsystems will
be held at the University of Maryland on January 21,
1999 for all interested parties. The meeting will determine
the objectives and structure of the alliance. Organizations interested in
attending the meeting should contact Dr. Peter Sandborn at CALCE-EPSC (University
of Maryland), (301) 405-3167,
sandborn@calce.umd.edu.
Sponsors:
CALCE The Computer Aided Life
Cycle Engineering Electronic Product and System Consortium (CALCE-EPSC)
at the University of Maryland consists of over 40 organizations with experience
in designing, testing, building and maintaining electronic products and systems.
Key Consortium members include: AlliedSignal, Rockwell Collins, Raytheon
Systems, Raytheon Sensors and Electronic Systems, Delphi Delco, Nokia, Nortel,
Honeywell, Lockheed-Martin, United Technologies, Boeing, Crane-Eldec,
Crane-Hydroaire, Smiths Industries, Vista Controls, General Motors, Visteon,
Anadrill Schlumberger, Innova Electronics, Teradyne, Sun Microsystems, Lambda
Technologies, Qualmark, and MTI, as well as NASA Jet Propulsion Laboratory,
and Sandia National Laboratories. The mission of CALCE is to develop a scientific
basis for innovative methodologies that dramatically decrease life cycle
risks for the next generation of electronic products and systems, and establish
an educational and technology transfer infrastructure for their rapid
dissemination and utilization.
Dense-Pac MicroSystems, Inc. - Dense-Pac
is a designer and manufacturer of ultra-high density memory products. Dense-Pac's
products utilize a patented, proprietary stacking technology that allow huge
amounts of memory to be used in high-performance computers and electronic
systems, with no significant increase in board size. Dense-Pac's memory
technology is used in such diverse areas as satellites, military equipment,
high performance engines, super computers, and telecommunications
equipment.
Dense-Pac is the predominant leader in the three-dimensional stackable memory
market. The Company's three-dimensional stack product achieves significant
reductions in integrated circuit board space, weight and cost. Major customers
include L.M. Ericsson Telephone, TRW, ITT Corp., Texas Instruments, and Motorola.