Meeting Announcement for January 21, 1999

3D Electronic Packaging Alliance

Meeting Time:  8:00 AM to 4:00 PM, January 21, 1999 Meeting Agenda:  Complete agenda available here
Meeting Location (Note - room change):  Room 2460, A.V. Williams Building (Building 115), University of Maryland, College Park, MD  
Directions & Hotels - the A.V. Williams building is located below and to the right of the "Engineering" building (Building 089) colored yellow on the map.
Press Releases:
12/22/98 - Dense-Pac press release on 3D Packaging Alliance
1/14/99 - EETimes Article on 3D Packaging Alliance

Three-dimensional packaging promises to provide increased electrical performance and packaging density over conventional two-dimensional approaches. Over the last 10 years, many organizations have developed novel 3D packaging technologies and methodologies that provide size and performance increases for a wide range of quality, reliability, manufacturability and cost impacts. The objective of this alliance is to facilitate the design, manufacture, and use of cost effective high density, high performance, and high reliability 3D packaging.

Alliance Membership:

Alliance Goals:

Organizational Meeting:
An organizational meeting sponsored by CALCE and Dense-Pac Microsystems will be held at the University of Maryland on January 21, 1999 for all interested parties. The meeting will determine the objectives and structure of the alliance. Organizations interested in attending the meeting should contact Dr. Peter Sandborn at CALCE-EPSC (University of Maryland), (301) 405-3167,

CALCE – The Computer Aided Life Cycle Engineering – Electronic Product and System Consortium (CALCE-EPSC) at the University of Maryland consists of over 40 organizations with experience in designing, testing, building and maintaining electronic products and systems. Key Consortium members include: AlliedSignal, Rockwell Collins, Raytheon Systems, Raytheon Sensors and Electronic Systems, Delphi Delco, Nokia, Nortel, Honeywell, Lockheed-Martin, United Technologies, Boeing, Crane-Eldec, Crane-Hydroaire, Smiths Industries, Vista Controls, General Motors, Visteon, Anadrill Schlumberger, Innova Electronics, Teradyne, Sun Microsystems, Lambda Technologies, Qualmark, and MTI, as well as NASA Jet Propulsion Laboratory, and Sandia National Laboratories. The mission of CALCE is to develop a scientific basis for innovative methodologies that dramatically decrease life cycle risks for the next generation of electronic products and systems, and establish an educational and technology transfer infrastructure for their rapid dissemination and utilization.

Dense-Pac MicroSystems, Inc. - Dense-Pac is a designer and manufacturer of ultra-high density memory products. Dense-Pac's products utilize a patented, proprietary stacking technology that allow huge amounts of memory to be used in high-performance computers and electronic systems, with no significant increase in board size. Dense-Pac's memory technology is used in such diverse areas as satellites, military equipment, high performance engines, super computers, and telecommunications equipment.
Dense-Pac is the predominant leader in the three-dimensional stackable memory market. The Company's three-dimensional stack product achieves significant reductions in integrated circuit board space, weight and cost. Major customers include L.M. Ericsson Telephone, TRW, ITT Corp., Texas Instruments, and Motorola.