Dr. Shuang (Jake) Yang Visiting Scientist, Maryland MEMS & Microfluidics Lab Research Scientist, IO Biosystems, Inc Tel.: (301) 405-1023 Fax: (240) 254-0800 E-mail: jakeyang@umd.edu, jake.yang@iobiosystems.com 3123 Glenn L. Martin Hall, College Park, MD 20742

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Education Ph.D., University of Maryland, College Park, 2008 M.S., National University of Singapore, 2003 M.S., Shanghai Jiaotong University, China, 1997 B.S., Harbin Institute of Technology, China, 1994 Research Interests Microfluidic system for bioanalysis Reliability analysis for electronic packaging and component Materials Characterization Scientific and Professional Membership IEEE; ACS (America Chemical Society); IMAPS (International Microelectronics And Packaging Society) Publications S. Yang, J. Liu, C.S. Lee, and D. DeVoe, “Microfluidic 2-D PAGE using multifunctional in-situ polyacrylamide gels and discontinuous buffers”, Lab Chip, Vol. 9, 2009, p. 592-599. S. Yang, J. Liu, and D. DeVoe, “Numerical simulation and optimization of electrokinetic injection in two-dimensional microchip”, Lab Chip, Vol. 8, 2008, p. 1145-1152. J. Liu, S. Yang, C.S. Lee, and D. DeVoe, “Polyacrylamide gel plugs enabling 2-D microfluidic protein separations via IEF and multiplexed SDS gel electrophoresis,” Electrophoresis, Vol. 29, Issue 11, 2008, p. 2241-2250. S. Yang, and A. Christou, “Failure model for silver electrochemical migration”, IEEE Transactions on Device and Materials Reliability, Vol. 7, Issue 1, 2007, p. 188-196. S. Yang, J. Wu, D. Tsai, and M. Pecht, “Contact resistance estimation for time-dependent silicone elastomer matrix of land grid array socket,” IEEE Transactions on Components and Packaging Technologies, Vol. 30, Issue 1, 2007, p. 81-85. S. Yang, J. Wu, and A. Christou, “Initial stage of silver electrochemical migration degradation,” Microelectronics Reliability, Vol. 46, 2006, p. 1915-1921. S. Yang, Y-W Zhang, and K. Zeng, “Analysis of nanoindentation creep for polymeric materials,” Journal of Applied Physics, Vol. 95, Issue 7, 2004, p. 3655-3666.